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Chips Wafer Grinding Double Sided Tissue Tape 50m (white)
Chips Wafer Grinding Double Sided Tissue Tape 50m (white)
Brand:
OEM
Model:
YWT-302FOS
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Product Description

This Yih Hwa double sided tissue tape is a high performance tape that provides excellent adhesion and high initial tack. It also possess high temperature and chemical resistant properties and can withstand up to a temperature of 100⁰C. It is suitable for application on device for chips wafer grinding and can adhere to various polishing material easily. It also removes cleanly and doe not leave any residue for the closed side. This allows for repositioning when required

Thickness : 130mic
Log size : 1250mm x 50m
Colour available : Clear
Liner : White Release Liner
Temperature Resistant : 100 Degrees
Peel Adhesion (Open Side): 22N/25mm
Peel Adhesion (Close Side): 1N/25mm

Application :
- Permanent adhesive is specially formulated to bond with low energy surface materials like PE and PP. At the same time, it is also suitable for application to other substrates
- It has semi-removable adhesive as it is designed to provide clean removal from a light duty bonding to variety of smooth surfaces for the closed side. Hence, offering reusability and repositioning when bonded surface is kept clean
- It provides temporary bonding of masking purpose in manufacturing or assembly of electronic parts and components

RM 10,376.25
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Lead time of 20 working days required.
Item will be ready to dispatch within the lead time specified.
Quantity:
EA
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MOQ of 1250 EA
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Bundle of 1 EA
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